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VP41306

The chassis is a OpenVPX COTS product for 3U and can be used for multiple applications by changing the switch on the backplane mezzanine to your needs.
The chassis features 16 slots total. 14 useable VPX slots and 2 power supply slots, one on each side of the chassis. This way the power units can be thermally attached to the sidewall.
Sealed chassis with high density cooling fins on the inner chassis, cooled by forced air from the front to the back. (ATR type cooling and sealing in 3U VPX) The fans are protected by shields.
High speed ERNI 10Gig connectors connect the backplane and the mezzanine cards and all active components are conduction cooled. The backplane and the mezzanine cards are held in place using a special rubber type insert, therefore it dampens the backplane/mezzanine assembly against vibrations. The cards do not experience stress on the connectors as it is usually the case in traditional backplanes which are screwed down at different points and apply stress during assembly, during wedgelock screw down and during extended temperature ranges as well as shock and vibration to all parts on those PCBs.
PCIe Gen 2 "noStub" routing is used throughout the system to maximize data throughput. Inter slot high speed communication connections are done on the mezzanine PCB. Also it is possible to use a Gb Ethernet switch and a serial Rapid I/O switch on this mezzanine, if needed.
The rear I/O PCB can be equipped with MIL-C-38999 series 3 connectors.
The chassis is chromatized on all surfaces before applying custom primary and secondary coatings. EMI is therefore minimized and can be further minimized by using SSC in the system.
Repair time is very short because the outside EXOCAGE metal armor is screwed to the chassis and the chassis itself can be opened on top, the backplane assembly is removed and reinserted very quickly, no screws are used.

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VP41301

该机箱是一款3U的OpenVPX 货架产品,通过改变夹层背板可满足多种应用场合的需求。该系统采用万兆高速连接器连接底板和夹层卡,所有的插卡都是可导冷的。背板和夹层卡被安置在使用一种特殊的橡胶型插入方式,可以有效缓解振动。与传统背板上的连接器受到的压力不同的是,在从不同位置装配拧紧时,在使用锁紧条锁紧时,在扩展温度范围以及冲击震荡工作环境时,这种背板上的连接器都不受力。GEN 2 PCIe noStub“路由应用在整个系统,以最大限度地提高数据吞吐量。槽间的高速通讯连接通过中层的PCB来实现。如果需要的话,这个夹层还可以实现一个千兆以太网交换和一个串行Rapid I / O交换。这个夹层卡上还集成了GPS模块,WiFi模块,温度和湿度的传感器和3D震动传感器IC。可以通过一个I2C总线读取数据,这个12C总线可连接到所有槽位,其中每一个槽位都是符合VITA规范的。
后I / O PCB可直连到 MIL-C-38999系列连接器上。我们提供各种标准I / O引脚配置。
机箱的表面在进行一道和二道的涂漆之前都已经铬化了。因此,EMI最小,另外通过在系统中使用SSC,能够进一步降低EMI。
铝质,以最小的重量保证其最大限度的坚固耐用。
内部采用锁紧固定, 以确良好的热传导到机箱壁。
背板,夹层和后I / O PCB都是夹紧固定在机壳以缓冲振动。

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